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2023

Journal
 
  1. W. Xu, Z.J. Li, Z.T. Fang, B. Wang, et al., “A sub-5mW monolithic CMOS-MEMS thermal flow sensing SoC with ±6m/s linear range,” IEEE Journal of Solid-State Circuits (JSSC), Accepted. Read PDF»

  2. M. Duan, Z.X. Peng, B. Wang, J. Wu, A. Khelif, Y.K. Lee, and A. Bermak, “A highly integrated Lab-on-a-CMOS platform for real-time monitoring of E. Coli growth kinetics,” IEEE Trans. Biomedical Circ. and Syst. (TBioCAS), Accepted. Read PDF»

  3. B. Wang, M. K. Law, and J. Schneider, “L2min2/2s: efficient linear reconstruction filter for incremental delta-sigma ADCs,” IEEE Trans. Signal Processing (TSP), vol. 71, pp. 3229-3241, 2023. Read PDF» or Access in IEEE»

  4. K. E. Jeon, T. N. Lin, J. She, S. Wong, R. Govindan, T. Al-Ansari, and B. Wang, “LuXSensing beacon: batteryless IoT sensor, design methodology, and field test for sustainable greenhouse monitoring,” IEEE Trans. AgriFood Electronics (TAFE), Accepted. Read PDF»

  5. T. Yang, M. D. Li, Z. J. Wang, Y. Yang, L. Zhang, B. Wang, and F. Tang, “A 100-ppm integrated TDM-based single-phase wattmeter for smart grid,” IEEE Trans. Circ. Syst. II: Express Briefs (TCAS-II), vol. 70, no. 2, pp. 406-410, Feb. 2023. Read PDF»

  6. Y. Yi, M. Chiao, K. A. Mahmoud, and B. Wang, “An MXene-doped PVA/PVP hydrogel-based strain sensor applicable in liquid environment,” Smart Materials and Structures, vol. 32, no. 2, pp. 025010, Jan. 2023. Read PDF»
Conference
 
  1. N. Fares, B. Wang and S. Bakiras, “Design and implementation of certificateless cryptography for IoT applications,” IEEE Int’l. Midwest Symp. Circ. Syst., Accepted. Read PDF»

  2. K. E. Jeon, J. She, and B. Wang, “Information-aware sensing framework for long-lasting IoT sensors in greenhouse,” IEEE Wireless Comm. and Networking Conf., Accepted. Read PDF»

2022

Journal
 
  1. B. Wang, and M. K. Law, “Subranging BJT-based CMOS temperature sensor with a ±0.45°C inaccuracy (3σ) from −50°C to 180°C and a resolution-FoM of 7.2 pJ·K² at 150°C,” IEEE Journal of Solid-State Circuits (JSSC), vol. 57, no. 12, pp. 3693-3703, Dec. 2022. Read PDF»

  2. M. A. Awan, M. Ahmed, and B. Wang, “A laser Doppler blood flow measurement system with a 151.4 dBΩ gain and 0.05% nonlinearity for PAD patients,” IEEE Sensor J., vol. 22, no. 14, pp. 14196-14204, July 2022. Read PDF»

  3. L. Al-Sahan, N. Lasla, A. Mohamed, and B. Wang, “BCSM: Blockchain-based cooperative spectrum management system for 5G NR-U and WiFi coexistence in the unlicensed band,” IET Communications, vol. 16, no. 9, pp. 977-987, June 2022. Read PDF»

  4. Y. Yi, M. Chiao, K. A. Mahmoud, L. Wu, and B. Wang, “Preparation and characterization of PVA/PVP conductive hydrogels formed by freeze–thaw processes as a promising material for sensor applications,” Journal of Materials Science, vol. 57, pp. 8029–8038, April 2022. Read PDF»

  5. M. A. Akbar, B. Wang, and A. Bermak, “Self-repairing carry-lookahead adder with hot-standby topology using fault-localization and partial reconfiguration,” IEEE Open Journal of Circuits and Systems (OJCAS), vol. 3, pp. 50-58, March 2022. Read PDF»

  6. Y. Yi, B. Wang, X. Liu, and C. Li, “Flexible piezoresistive strain sensor based on CNTs–polymer composites: a brief review,” Carbon Letters, Feb. 2022. Read PDF»

  7. T. N. Lin, B. Wang, and A. Bermak, “Analysis of output ripple shape and amplitude in chopper instrumentation amplifier,” IEEE Trans. Circ. Syst. II: Express Briefs (TCAS-II), vol. 69, no. 2, pp. 299-303, Feb. 2022. Read PDF»
Conference
 
  1. N. A. Quadir, M. Hamdi, M. A. Awan, B. Wang and A. Bermak, “Design and analysis of a dual-band bistatic backscatter circuit for passive RFID tags,” IEEE Int’l. Symp. Embedded Multicore/Many-core Systems-on-Chip (MCSoC), pp. 301-304, Dec. 2022. Read PDF»

  2. Z. J. Li, Z. T. Fang, B. Wang, M. Ahmed, X. F. Pan, S. T. Han, X. J. Zhao, and W. Xu, “System-level modeling and design of a temperature compensated CMOS MEMS thermal flow sensor,” IEEE Int’l. Symp. Circ. Syst., May. 2022. Read PDF»

  3. B. Wang, M. K. Law, and A. Bermak, “A BJT-based CMOS temperature sensor achieving an inaccuracy of ±0.45oC (3σ) from -50oC to 180oC and a resolution-FoM of 7.2pJ·K2 at 150oC,” IEEE Int’l. Solid-State Circ. Conf. (ISSCC), pp. 72-74, Feb. 2022. Read PDF»

2021

Journal
 
  1. S. Khan, S. Ali, A. Khan, B. Wang, T. Al-Ansari, and A. Bermak, “Substrate treatment evaluation and their impact on printing results for wearable electronics,” Frontiers in Electronics, Nov. 2021. Read PDF»

  2. T. N. Lin, B. Wang, and A. Bermak, “Ripple suppression in capacitive-gain chopper instrumentation amplifier using amplifier slicing,” IEEE Trans. Circ. and Syst. I: Regular Papers (TCAS-I), vol. 68, no. 10, pp. 3991-4000, Oct. 2021. Read PDF»

  3. Z. Z. Zeng, J. J. Lopez, B. Wang, and E. S. Sinencio, “A CMOS energy harvesting interface circuit with cycle-to-cycle frequency-to-amplitude conversion MPPT for centimeter-scale wind turbine,” IEEE Trans. Circ. and Syst. I: Regular Papers (TCAS-I), vol. 68, no. 9, pp. 3587-3597, Sept. 2021. Read PDF»

  4. K. Khan, S. Ali, A. Khan, B. Wang, and A. Bermak, “Inkjet printing of multi-stripes based deflection monitoring sensor on flexible substrate,” Sensors and Actuators A: Physical, June 2021. Read PDF»

  5. A Khan, S Ali, S Khan, M Ahmed, B Wang, and A Bermak, “Vacuum-free fabrication of transparent electrodes for soft electronics,” Nanofibers: Book Chapter-16, May 2021. Read PDF»

  6. A. Khan, K. Rahman, S. Ali, S. Khan, B. Wang, and A. Bermak, “Fabrication of circuits by multi-nozzle electrohydrodynamic inkjet printing for soft wearable electronics,” Journal of Materials Research, vol. 36, pp. 3568–3578, April 2021. Read PDF»

  7. Y. Yi, C. Mu, and B. Wang, “An electrochemically actuated drug delivery device with in-situ dosage sensing,” Smart Materials and Structures, vol. 30, no. 5, pp. 1-9, March 2021. Read PDF»

  8. K. Khan, S. Ali, A. Khan, B. Wang, and A. Bermak, “Printing sensors on biocompatible substrates for selective detection of glucose,” IEEE Sensor J., vol. 21, no. 4, pp. 4167-4175, Feb. 2021. Read PDF»

  9. M. Akbar, B. Wang, and A. Bermak, “A high-speed parallel architecture for ripple carry adder with fault detection and localization,” Electronics, 1791, Jan. 2021. Read PDF»

  10. Y. Yi, A. Samara, and B. Wang, “A new approach for an ultra-thin piezoresistive sensor based on solidified carbon ink film,” Journal of Materials Science (JMS), 56, 607–614 (2021). Read PDF»
Conference
 
  1. B. Wang, S. W. Wang, and M. K. Law, “On low-Leakage CMOS switches,” IEEE Int’l. Midwest Symp. Circ. Syst., Aug. 2021. Read PDF»

  2. N. A. Quadir, M. A. Awan, A. Mohamed, and B. Wang, “An active inductor based TIA with ambient light rejection for VLC applications,” IEEE Int’l. Midwest Symp. Circ. Syst., Aug. 2021. Read PDF»

  3. M. A. Awan, B. Wang, N. A. Quadir, and A. Bermak, “Review and analysis of CMOS current readout circuits for biosensing applications,” IEEE Int’l. Symp. Circ. Syst., May. 2021. Read PDF»

  4. J. H. Fernandez, B. Wang, A. Massoud, S. Talib, M. Shhaab, and A. Mohamed, “On ambient temperature of transformer substations in desert climates,” IEEE PES Innovative Smart Grid Technologies, Feb. 2021. Read PDF»

2020

Journal
 
  1. M. Akbar, B. Wang, and A. Bermak, “Self-repairing hybrid adder with hot-standby topology using fault-localization,” IEEE Access, vol. 8, pp. 150051-150058, Aug. 2020. Read PDF»

  2. B. Wang, M.-K. Law, S. Brahim Belhaouari, and A. Bermak, “Near-optimal decoding of incremental delta-Sigma ADC output,” IEEE Trans. Circ. and Syst. I: Regular Papers (TCAS-I), vol. 67, no. 11, pp. 3670-3680, Nov. 2020. Read PDF»

  3. F. Tang et al., “A noise-reduced light-to-frequency converter for sub-0.1% perfusion index blood SpO2 sensing,” IEEE Trans. Biomed. Circ. and Syst. (TBioCAS), vol. 14, no. 5, pp. 931-941, Oct. 2020. Read PDF»

  4. F. Tang et al., “A 32-Step phase-compensated spread-spectrum RF-PLL with 19.44-dB EMI reduction and 10-fs extra RMS jitter,” IEEE Trans. Microw. Theory Techn. (TMTT), vol. 68, no. 4, pp. 1564-1575, April 2020. Read PDF»
Conference
 
  1. B. Wang, M.-K. Law, S. Brahim Belhaouari, and A. Bermak, “Near-optimal decoding of incremental delta-sigma ADC output,” IEEE Int’l. Symp. on Integrated Circ. Syst., Aug. 2020. Read PDF»

  2. B. Wang, M. K. Law, and A. Bermak, “On fully differential incremental ΔΣ ADC with initial feedback zeroing and 1.5-Bit feedback," IEEE Int’l. Symp. Circ. Syst., May. 2020. Read PDF»

  3. Tobi Delbruck et. al., “Invited Paper: lessons learned the hard way," IEEE Int’l. Symp. Circ. Syst., May. 2020. Read PDF»

  4. T. N. Lin, B. Wang, S. B. Belhaouari, and A. Bermak, “A chopper instrumentation amplifier with amplifier slicing technique for offset reduction," IEEE Int’l. Symp. Circ. Syst., May. 2020. Read PDF»

  5. S. Khan, S. Ali, H. Mohsin, B. Wang, and A. Bermak, “Printing sensor on flexible substrates for detection of volatile organic compounds," IEEE Int’l. Symp. Circ. Syst., May. 2020. Read PDF»

  6. Z. Z. Zeng, S. P. Shen, B. Wang, J. Johan, R. Murch, and E. Sánchez, “An ultra-low-power power management circuit with output bootstrapping and reverse leakage reduction function for RF energy harvesting," IEEE/MTT-S Int’l. Microwave Symp., June 2020. Read PDF»

Before 2020

Journal
 
  1. B. Wang, M.-K. Law, J. Yi, C.-Y. Tsui, and A. Bermak, “A -12.3 dBm UHF passive RFID sense tag for grid thermal monitoring,” IEEE Trans. Ind. Electron. (TIE), vol. 66, no. 11, pp. 8811-8820, Nov. 2019. Read PDF»

  2. Y. Yi, B. Wang, and A. Bermak, “A low-cost strain gauge displacement sensor fabricated via shadow mask printing,” Sensors, 4713, Oct. 2019. Read PDF»

  3. C. Li, B. Wang, Huang, R., and Y. Yi, “A resonant coupling power transfer system using two driving coils,” Energies, 2914, July 2019. Read PDF»

  4. W. Xu, B. Wang, M. Z. Duan, M. Ahmed, A. Bermak, and Y. K. Lee, “A 3D integrated micro calorimetric flow sensor in CMOS MEMS technology,” IEEE Sensors Letters, vol. 3, no. 2, pp. 1-4, Feb. 2019. Read PDF»

  5. B. Wang, M.-K. Law, C.-Y. Tsui, and A. Bermak, “A 10.6 pJ·K2 resolution FoM temperature sensor using astable multivibrator,” IEEE Trans. Circ. Syst. II: Express Briefs (TCAS-II), vol. 65, no. 7, pp. 869-873, July 2018. Read PDF»

  6. F. Tang, S. Li, B. Wang, A. Bermak, X. Zhou, and S. Hu, "A low power class-AB audio power amplifier with dynamic transconductance compensation in 55 nm CMOS process," IEEE Trans. Circ. and Syst. I: Regular Papers (TCAS-I), vol. 63, no. 9, pp. 1360-1369, Sept. 2016. Read PDF»

  7. F. Tang, B. Wang, and A. Bermak, “A column-parallel inverter-based cyclic ADC for CMOS image sensor with capacitance and clock scaling,” IEEE Trans. Electron Devices (TED), vol. 63, no.1, pp.162-167, Jan. 2016. Read PDF»

  8. B. Wang, M.-K. Law, A. Bermak, and F. Tang, “BJT process spread compensation utilizing base recombination current in standard CMOS,” IEEE Electron Device Lett. (EDL), vol.36, no.11, pp.1111-1113, Nov. 2015. Read PDF»

  9. B. Wang, M.-K. Law, and A. Bermak, “A precision CMOS voltage reference exploiting silicon bandgap narrowing effect,” IEEE Trans. Electron Devices (TED), vol.62, no.7, pp.2128 - 2135, Jul. 2015. Read PDF»

  10. B. Wang, M.-K. Law, A. Bermak, and H.-C. Luong, “A passive RFID tag embedded temperature sensor with improved process spreads immunity for a -30 oC to 60 oC sensing range,” IEEE Tran. Circ. Syst. I: Reg. Papers (TCAS-I), vol.61, no.2, pp. 337 - 346, Feb. 2014. Read PDF»

  11. F. Tang, D.-G. Chen, B. Wang, and A. Bermak, “CMOS on-chip stable true-random ID generation using antenna effect,” IEEE Electron Device Lett. (EDL), vol.35, no.1, pp. 54 - 56, Jan. 2014. Read PDF»

  12. F. Tang, D.-G. Chen, B. Wang, and A. Bermak, “Low-power CMOS image sensor based on column-parallel single-slope/SAR quantization scheme,” IEEE Trans. Electron Devices (TED), vol.60, no.8, pp. 2561 - 2566, Aug. 2013. Read PDF»
Conference
 
  1. B. Wang, J. H. Fernandez, and A. Massoud, “A wireless battery temperature monitoring system for electric vehicle charging," IEEE Sensors Conf., Montreal, Canada, Nov. 2019. Read PDF»

  2. Y. Yi, S. Ali, and B. Wang, “An inkjet-printed strain sensor with a carbon-silver-polyimide topology,” IEEE Int’l. Conf. on Flexible and Printable Sensors and Systems, Glasgow, UK, July. 2019. Read PDF»

  3. T. N. Lin, B. Wang, and A. Bermak, “Review and analysis of instrumentation amplifier for IoT applications,” IEEE Int’l. Midwest Symp. Circ. Syst., Windsor, Canada, Aug. 2018. Read PDF»

  4. T. T. Zhang, M.-K. Law, B. Wang, Pui-In Mak, Mang-I Vai, and R. P. Martins, “A 310 nW 14.2-bit iterative-incremental ADC for wearable sensing systems,” IEEE Int’l. Symp. Circ. Syst., May 2017. Read PDF»

  5. D. P. Sun, M.-K. Law, B. Wang, Pui-In Mak, and R. P. Martins, “Piecewise BJT process spread compensation exploiting base recombination current,” IEEE Int’l. Symp. Circ. Syst., May 2017. Read PDF»

  6. W. Xu, B. Gao, M. Ahmed, M. Duan, B. Wang, S. Mohamad, A. Bermak, and Y.-K. Lee, “A wafer-level encapsulated CMOS-MESM thermoresistive calorimetric flow sensor with integrated packaging design,” IEEE Int’l. Conf. Micro Electro Mechanical Syst., Jan. 2017. Read PDF»

  7. X. Lu, B. Wang, Z.-H. Wen, X.-J. Zhao, Y. Cao, and A. Bermak, "A low power relaxation oscillator with process insensitive auto-calibration scheme," IEEE Asia Pacific Conf. Circ. Syst. (APCCAS), Oct. 2016. Read PDF»

  8. B. Zhang, X.-P. Zhong, B. Wang, P. Sander, and A. Bermak, “Wide dynamic range PSD algorithms and their implementation for compressive imaging,” IEEE Int’l. Symp. Circ. Syst., Montreal, QC, pp. 2727-2730, May 2016. Read PDF»

  9. B. Wang, M.-K. Law, S. Mohamad, and A. Bermak, “A 2.2uW 15b incremental delta-sigma A/D with output-driven input segmentation,” IEEE/ACM Asia and South Pacific Design Automation Conf., University Design Contest, Jan. 2016. (Best Design Award). Read PDF»

  10. X.-P. Zhong, B. Wang, and A. Bermak, “A reconfigurable time-domain comparator for multi-sensing applications,” IEEE Int’l. Symp. Circ. Syst., Lisbon, Portugal, pp. 349 – 352, May 2015. Read PDF»

  11. B. Wang, M.-K. Law, and A. Bermak, “A low-cost capacitive relative humidity sensor for food moisture monitoring application,” Asia Symp. Quality Electronic Design, Penang, Malaysia, pp. 95 - 99, July 2012. Read PDF»

  12. F. Tang, B. Wang, and A. Bermak, “80 dB dynamic range 100 kHz bandwidth inverter-based ADC for CMOS image sensor,” IEEE Int’l. Symp. Circ. Syst., Seoul, Korea, pp. 3094-3097, May 2012. Read PDF»

  13. B. Wang, M.-K. Law, and A. Bermak, “A sub-1V BJT-based CMOS temperature sensor from -55 oC to 125 oC,” IEEE Int’l. Symp. Circ. Syst., Seoul, Korea, pp.3114-3117, May 2012. Read PDF»

    14.  

Patents

 
  1. CN104156757 A, “Passive ultrahigh-frequency ultralow-power consumption RFID chip with built-in temperature sensor”. [link]

  2. CN105928632A, “A Temperature Sensor Front-end Structure”. [link]

  3. CN106067818A, “An Integrating Type A/D with Leakage Compensation at High Temperature”. [link]

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