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Journal Publications

  1. A. Raza, S. B. Belhaouari, and B. Wang, “TinyLPFNet: A Near-Imager FPGA Accelerator for Real-Time Human Activity Recognition,” IEEE Trans. Circuits Syst. II, Exp. Briefs (TCAS-II), early access, 2026.
  2. J. Z. Li, Y. Zhou, F. B. Guo, M. Li, B. Wang, X. Y. Wang, S. R. Dong, X. H. Liu, and F. Gao, “Passive Wireless Bolt Preload Monitoring Based on Magnetic Resonance Coupled Ultrasonic Time-of-Flight,” IEEE Trans. Instrum. Meas. (TIM), vol. 75, Art. no. 9524911, 2026.
  3. A. Abubakar, B. Wang, and A. Bermak, “A 1.5-2.0 TOPS/W 2T-Pixel CMOS Imager with Programmable In-Pixel Multi-Bit Feature Extraction,” IEEE Trans. Circuits Syst. I, Reg. Papers (TCAS-I), vol. 73, no. 7, pp. 4686–4696, Jul. 2026.
  4. X. Y. Song, L. F. Huang, L. Z. Hong, B. Wang, X. F. Pan, and W. Xu, “A Single-Chip Pulse-Driven CMOS-MEMS Flow Sensing System with Sub-mm/s Flow Detection Limit,” IEEE Trans. Circuits Syst. I, Reg. Papers (TCAS-I), vol. 73, no. 1, pp. 51–59, Jan. 2026.
  5. Y. J. Geng, H. C. Lin, B. Wang, and C. Wang, “Cryo-CMOS Dual-Qubit Homodyne Reflectometer Array with Degenerate Parametric Amplification,” IEEE J. Solid-State Circuits (JSSC), vol. 59, no. 10, pp. 3290–3306, Oct. 2024.
  6. M. A. Awan, K. Ahmad, A. Bermak, K. H. Biswas, and B. Wang, “An Asynchronous CMOS Current Readout with 124-dB Dynamic Range for Bioluminescence Sensing,” IEEE Solid-State Circuits Lett. (SSCL), vol. 7, pp. 223–226, 2024.
  7. W. Xu, Z. J. Li, Z. T. Fang, B. Wang, et al., “A Sub-5mW Monolithic CMOS-MEMS Thermal Flow Sensing SoC with ±6 m/s Linear Range,” IEEE J. Solid-State Circuits (JSSC), vol. 59, no. 5, pp. 1486–1496, May 2024.
  8. M. Z. Duan, X.-P. Zhong, B. Wang, A. Khelif, Y.-K. Lee, and A. Bermak, “A Highly Integrated Lab-on-a-CMOS Platform for Real-Time Monitoring of E. Coli Growth Kinetics,” IEEE Trans. Biomed. Circuits Syst. (TBioCAS), vol. 18, no. 1, pp. 174–185, Feb. 2024.
  9. Y. J. Geng, H. C. Lin, B. Wang, and C. Wang, “A Cryo-CMOS Parametric Frequency Divider with −189.1 dBm/Hz Output Noise Floor at 4.2 K for High-Fidelity All-Parametric Quantum Reflectometer,” IEEE Microw. Wireless Technol. Lett. (MWTL), vol. 33, no. 12, pp. 1650–1653, Dec. 2023.
  10. B. Wang, M.-K. Law, and J. Schneider, “L2min2/2s: Efficient Linear Reconstruction Filter for Incremental Delta-Sigma ADCs,” IEEE Trans. Signal Process. (TSP), vol. 71, pp. 3229–3241, 2023.
  11. K. E. Jeon, T. N. Lin, J. She, S. Wong, R. Govindan, T. Al-Ansari, and B. Wang, “LuXSensing Beacon: Batteryless IoT Sensor, Design Methodology, and Field Test for Sustainable Greenhouse Monitoring,” IEEE Trans. AgriFood Electron. (TAFE), vol. 1, no. 2, pp. 86–98, Dec. 2023.
  12. T. Yang, M. D. Li, Z. J. Wang, Y. Yang, L. Zhang, B. Wang, and F. Tang, “A 100-ppm Integrated TDM-Based Single-Phase Wattmeter for Smart Grid,” IEEE Trans. Circuits Syst. II, Exp. Briefs (TCAS-II), vol. 70, no. 2, pp. 406–410, Feb. 2023.
  13. B. Wang and M.-K. Law, “Subranging BJT-Based CMOS Temperature Sensor with a ±0.45°C Inaccuracy (3σ) from −50°C to 180°C and a Resolution-FoM of 7.2 pJ·K² at 150°C,” IEEE J. Solid-State Circuits (JSSC), vol. 57, no. 12, pp. 3693–3703, Dec. 2022.
  14. M. A. Awan, M. Ahmed, and B. Wang, “A Laser Doppler Blood Flow Measurement System with a 151.4 dBΩ Gain and 0.05% Nonlinearity for PAD Patients,” IEEE Sensors J. (JSEN), vol. 22, no. 14, pp. 14196–14204, Jul. 2022.
  15. M. A. Akbar, B. Wang, and A. Bermak, “Self-Repairing Carry-Lookahead Adder with Hot-Standby Topology Using Fault-Localization and Partial Reconfiguration,” IEEE Open J. Circuits Syst. (OJCAS), vol. 3, pp. 50–58, 2022.
  16. T. N. Lin, B. Wang, and A. Bermak, “Analysis of Output Ripple Shape and Amplitude in Chopper Instrumentation Amplifier,” IEEE Trans. Circuits Syst. II, Exp. Briefs (TCAS-II), vol. 69, no. 2, pp. 299–303, Feb. 2022.
  17. T. N. Lin, B. Wang, and A. Bermak, “Ripple Suppression in Capacitive-Gain Chopper Instrumentation Amplifier Using Amplifier Slicing,” IEEE Trans. Circuits Syst. I, Reg. Papers (TCAS-I), vol. 68, no. 10, pp. 3991–4000, Oct. 2021.
  18. Z. Z. Zeng, J. J. Estrada-López, B. Wang, and E. Sánchez-Sinencio, “A CMOS Energy Harvesting Interface Circuit with Cycle-to-Cycle Frequency-to-Amplitude Conversion MPPT for Centimeter-Scale Wind Turbine,” IEEE Trans. Circuits Syst. I, Reg. Papers (TCAS-I), vol. 68, no. 9, pp. 3587–3597, Sep. 2021.
  19. S. Khan, S. Ali, A. Khan, B. Wang, and A. Bermak, “Printing Sensors on Biocompatible Substrates for Selective Detection of Glucose,” IEEE Sensors J. (JSEN), vol. 21, no. 4, pp. 4167–4175, Feb. 2021.
  20. M. A. Akbar, B. Wang, and A. Bermak, “Self-Repairing Hybrid Adder with Hot-Standby Topology Using Fault-Localization,” IEEE Access (Access), vol. 8, pp. 150051–150058, 2020.
  21. B. Wang, M.-K. Law, S. B. Belhaouari, and A. Bermak, “Near-Optimal Decoding of Incremental Delta-Sigma ADC Output,” IEEE Trans. Circuits Syst. I, Reg. Papers (TCAS-I), vol. 67, no. 11, pp. 3670–3680, Nov. 2020.
  22. F. Tang, et al., “A Noise-Reduced Light-to-Frequency Converter for Sub-0.1% Perfusion Index Blood SpO2 Sensing,” IEEE Trans. Biomed. Circuits Syst. (TBioCAS), vol. 14, no. 5, pp. 931–941, Oct. 2020.
  23. F. Tang, et al., “A 32-Step Phase-Compensated Spread-Spectrum RF-PLL with 19.44-dB EMI Reduction and 10-fs Extra RMS Jitter,” IEEE Trans. Microw. Theory Techn. (TMTT), vol. 68, no. 4, pp. 1564–1575, Apr. 2020.
  24. B. Wang, M.-K. Law, J. Yi, C.-Y. Tsui, and A. Bermak, “A −12.3 dBm UHF Passive RFID Sense Tag for Grid Thermal Monitoring,” IEEE Trans. Ind. Electron. (TIE), vol. 66, no. 11, pp. 8811–8820, Nov. 2019.
  25. W. Xu, B. Wang, M. Z. Duan, M. Ahmed, A. Bermak, and Y.-K. Lee, “A Three-Dimensional Integrated Micro Calorimetric Flow Sensor in CMOS MEMS Technology,” IEEE Sensors Lett. (LSENS), vol. 3, no. 2, pp. 1–4, Feb. 2019.
  26. B. Wang, M.-K. Law, C.-Y. Tsui, and A. Bermak, “A 10.6 pJ·K2 Resolution FoM Temperature Sensor Using Astable Multivibrator,” IEEE Trans. Circuits Syst. II, Exp. Briefs (TCAS-II), vol. 65, no. 7, pp. 869–873, Jul. 2018.
  27. F. Tang, S. Li, B. Wang, A. Bermak, X. Zhou, and S. Hu, “A Low Power Class-AB Audio Power Amplifier with Dynamic Transconductance Compensation in 55 nm CMOS Process,” IEEE Trans. Circuits Syst. I, Reg. Papers (TCAS-I), vol. 63, no. 9, pp. 1360–1369, Sep. 2016.
  28. F. Tang, B. Wang, A. Bermak, X. Zhou, S. Hu, and X. He, “A Column-Parallel Inverter-Based Cyclic ADC for CMOS Image Sensor with Capacitance and Clock Scaling,” IEEE Trans. Electron Devices (TED), vol. 63, no. 1, pp. 162–167, Jan. 2016.
  29. B. Wang, M.-K. Law, A. Bermak, and F. Tang, “BJT Process Spread Compensation Utilizing Base Recombination Current in Standard CMOS,” IEEE Electron Device Lett. (EDL), vol. 36, no. 11, pp. 1111–1113, Nov. 2015.
  30. B. Wang, M.-K. Law, and A. Bermak, “A Precision CMOS Voltage Reference Exploiting Silicon Bandgap Narrowing Effect,” IEEE Trans. Electron Devices (TED), vol. 62, no. 7, pp. 2128–2135, Jul. 2015.
  31. B. Wang, M.-K. Law, A. Bermak, and H.-C. Luong, “A Passive RFID Tag Embedded Temperature Sensor with Improved Process Spreads Immunity for a −30°C to 60°C Sensing Range,” IEEE Trans. Circuits Syst. I, Reg. Papers (TCAS-I), vol. 61, no. 2, pp. 337–346, Feb. 2014.
  32. F. Tang, D.-G. Chen, B. Wang, A. Bermak, A. Amira, and S. Mohamad, “CMOS On-Chip Stable True-Random ID Generation Using Antenna Effect,” IEEE Electron Device Lett. (EDL), vol. 35, no. 1, pp. 54–56, Jan. 2014.
  33. F. Tang, D.-G. Chen, B. Wang, and A. Bermak, “Low-Power CMOS Image Sensor Based on Column-Parallel Single-Slope/SAR Quantization Scheme,” IEEE Trans. Electron Devices (TED), vol. 60, no. 8, pp. 2561–2566, Aug. 2013.

Conference Publications

  1. M. A. Awan, M. H. Farooq, A. Bermak, M. A. Akram, and B. Wang, “A 4 nW 114 dB DR Electrochemical Sensing Interface IC with Digital-Intensive Regulation Loop,” IEEE Int. Symp. Circuits Syst. (ISCAS), Shanghai, China, pp. 4513–4517, May 2026.
  2. H. Sang, Z. Wang, L. He, G. Zhao, W. Xie, B. Wang, R. P. Martins, and M.-K. Law, “VoxCAD: A 0.82-to-81.0 mW Intelligent 3D-Perception dToF SoC with Sector-Wise Voxelization and High-Density Tri-Mode eDRAM CIM Macro,” IEEE Int. Solid-State Circuits Conf. (ISSCC), San Francisco, CA, USA, pp. 114–116, Feb. 2026.
  3. A. Ghonem, A. Bermak, and B. Wang, “Incremental Delta-Sigma ADC with Reduced Conversion Cycles via Quantization-Skip,” IEEE Int. Symp. Circuits Syst. (ISCAS), London, UK, pp. 1–4, May 2025.
  4. N. A. Quadir, M. A. Awan, B. Wang, and A. Bermak, “Current-Mirror Based Ambient Light Rejection Technique for VLC Receiver,” IEEE Int. Symp. Circuits Syst. (ISCAS), London, UK, pp. 1–4, May 2025.
  5. B. Wang, A. Bermak, and M.-K. Law, “A 16-Bit Incremental ADC Enabled by an Efficient Shooting Integrator with Inherent Noise Reduction,” IEEE Custom Integr. Circuits Conf. (CICC), Boston, MA, USA, pp. 1–3, Apr. 2025.
  6. X. L. Chen, J. C. Wu, B. Wang, and M.-K. Law, “A 0.9V CMOS Voltage Reference with 0.41% Untrimmed Accuracy and 44.7 ppm/°C TC from −35°C to 130°C,” IEEE Asian Solid-State Circuits Conf. (A-SSCC), Hiroshima, Japan, pp. 1–3, Nov. 2024.
  7. K. Hu, J. C. Wu, B. Wang, and M.-K. Law, “A 33.6nW Capacitively Coupled Chopper Amplifier with Stacked Input-Boosted Gate-and-Bulk-Driven Inverter Achieving 0.59 NEF and 0.42 PEF in 180nm CMOS,” IEEE Asian Solid-State Circuits Conf. (A-SSCC), Hiroshima, Japan, pp. 1–3, Nov. 2024.
  8. M. A. Awan, S. Shurbaji, A. Bermak, K. H. Biswas, and B. Wang, “A Low Noise Current Readout with 124 dB Dynamic Range for Bioluminescence Sensing,” IEEE Biomed. Circuits Syst. Conf. (BioCAS), Xi’an, China, pp. 1–5, Oct. 2024.
  9. A. Bermak, T. Liu, Z. Zhao, B. Wang, and M. Zhang, “20 Years of Biomedical Image Acquisition and Processing at BioCAS,” IEEE Biomed. Circuits Syst. Conf. (BioCAS), Xi’an, China, pp. 1–8, Oct. 2024.
  10. Y. J. Geng, H. C. Lin, B. Wang, and C. Wang, “A Cryo-CMOS 4.5~7GHz Dual-Qubit Homodyne Reflectometer Array with High Q Degenerate Parametric Amplifier Through Dynamic Mode Coupling,” IEEE Asian Solid-State Circuits Conf. (A-SSCC), Haikou, China, pp. 1–2, Nov. 2023.
  11. N. Fares, B. Wang, and S. Bakiras, “Design and Implementation of Certificateless Cryptography for IoT Applications,” IEEE Int. Midwest Symp. Circuits Syst. (MWSCAS), Tempe, AZ, USA, pp. 933–937, Aug. 2023.
  12. K. E. Jeon, J. She, and B. Wang, “Information-Aware Sensing Framework for Long-Lasting IoT Sensors in Greenhouse,” IEEE Wireless Commun. Netw. Conf. (WCNC), Glasgow, UK, pp. 1–6, Mar. 2023.
  13. N. A. Quadir, M. Hamdi, M. A. Awan, B. Wang, and A. Bermak, “Design and Analysis of a Dual-Band Bistatic Backscatter Circuit for Passive RFID Tags,” IEEE Int. Symp. Embedded Multicore/Many-core Syst.-on-Chip (MCSoC), Penang, Malaysia, pp. 301–304, Dec. 2022.
  14. Z. J. Li, Z. T. Fang, B. Wang, M. Ahmed, X. F. Pan, S. T. Han, X.-J. Zhao, and W. Xu, “System-Level Modeling and Design of a Temperature Compensated CMOS MEMS Thermal Flow Sensor,” IEEE Int. Symp. Circuits Syst. (ISCAS), Austin, TX, USA, pp. 2072–2076, May 2022.
  15. B. Wang, M.-K. Law, and A. Bermak, “A BJT-Based CMOS Temperature Sensor Achieving an Inaccuracy of ±0.45°C (3σ) from −50°C to 180°C and a Resolution-FoM of 7.2 pJ·K2 at 150°C,” IEEE Int. Solid-State Circuits Conf. (ISSCC), San Francisco, CA, USA, pp. 72–74, Feb. 2022.
  16. B. Wang, S. W. Wang, and M.-K. Law, “On Low-Leakage CMOS Switches,” IEEE Int. Midwest Symp. Circuits Syst. (MWSCAS), Lansing, MI, USA, pp. 1–5, Aug. 2021.
  17. N. A. Quadir, M. A. Awan, M. Abdallah, and B. Wang, “An Active Inductor Based TIA with Ambient Light Rejection for VLC Applications,” IEEE Int. Midwest Symp. Circuits Syst. (MWSCAS), Lansing, MI, USA, pp. 882–885, Aug. 2021.
  18. M. A. Awan, B. Wang, N. A. Quadir, and A. Bermak, “Review and Analysis of CMOS Current Readout Circuits for Biosensing Applications,” IEEE Int. Symp. Circuits Syst. (ISCAS), Daegu, Korea, pp. 1–5, May 2021.
  19. J. H. Fernandez, B. Wang, A. Massoud, S. Talib, M. Shhaab, and A. Mohamed, “On Ambient Temperature of Transformer Substations in Desert Climates,” IEEE PES Innov. Smart Grid Technol. Conf. (ISGT), Washington, DC, USA, pp. 1–4, Feb. 2021.
  20. B. Wang, M.-K. Law, and A. Bermak, “On Fully Differential Incremental ΔΣ ADC with Initial Feedback Zeroing and 1.5-Bit Feedback,” IEEE Int. Symp. Circuits Syst. (ISCAS), Seville, Spain, pp. 1–5, Oct. 2020.
  21. T. Delbruck, et al., “Lessons Learned the Hard Way (Invited Paper),” IEEE Int. Symp. Circuits Syst. (ISCAS), Seville, Spain, pp. 1–18, Oct. 2020.
  22. T. N. Lin, B. Wang, S. B. Belhaouari, and A. Bermak, “A Chopper Instrumentation Amplifier with Amplifier Slicing Technique for Offset Reduction,” IEEE Int. Symp. Circuits Syst. (ISCAS), Seville, Spain, pp. 1–5, Oct. 2020.
  23. S. Khan, S. Ali, H. M. Al-Mohsin, B. Wang, and A. Bermak, “Printing Sensor on Flexible Substrates for Detection of Volatile Organic Compounds,” IEEE Int. Symp. Circuits Syst. (ISCAS), Seville, Spain, pp. 1–5, Oct. 2020.
  24. Z. Z. Zeng, S. P. Shen, B. Wang, J. J. Estrada-López, R. Murch, and E. Sánchez-Sinencio, “An Ultra-Low-Power Power Management Circuit with Output Bootstrapping and Reverse Leakage Reduction Function for RF Energy Harvesting,” IEEE/MTT-S Int. Microw. Symp. (IMS), Los Angeles, CA, USA, pp. 1059–1062, Aug. 2020.
  25. B. Wang, J. H. Fernandez, and A. Massoud, “A Wireless Battery Temperature Monitoring System for Electric Vehicle Charging,” IEEE Sensors Conf. (SENSORS), Montreal, QC, Canada, pp. 1–4, Oct. 2019.
  26. Y. Yi, S. Ali, and B. Wang, “An Inkjet-Printed Strain Sensor with a Carbon-Silver-Polyimide Topology,” IEEE Int. Conf. Flexible Printable Sensors Syst. (FLEPS), Glasgow, UK, pp. 1–3, Jul. 2019.
  27. T. N. Lin, B. Wang, and A. Bermak, “Review and Analysis of Instrumentation Amplifier for IoT Applications,” IEEE Int. Midwest Symp. Circuits Syst. (MWSCAS), Windsor, ON, Canada, pp. 258–261, Aug. 2018.
  28. T.-T. Zhang, M.-K. Law, B. Wang, P.-I. Mak, M.-I. Vai, and R. P. Martins, “A 310 nW 14.2-Bit Iterative-Incremental ADC for Wearable Sensing Systems,” IEEE Int. Symp. Circuits Syst. (ISCAS), Baltimore, MD, USA, pp. 1–4, May 2017.
  29. D. P. Sun, M.-K. Law, B. Wang, P.-I. Mak, and R. P. Martins, “Piecewise BJT Process Spread Compensation Exploiting Base Recombination Current,” IEEE Int. Symp. Circuits Syst. (ISCAS), Baltimore, MD, USA, pp. 1–4, May 2017.
  30. W. Xu, B. Gao, M. Ahmed, M. Z. Duan, B. Wang, S. Mohamad, A. Bermak, and Y.-K. Lee, “A Wafer-Level Encapsulated CMOS MEMS Thermoresistive Calorimetric Flow Sensor with Integrated Packaging Design,” IEEE Int. Conf. Micro Electro Mech. Syst. (MEMS), Las Vegas, NV, USA, pp. 989–992, Jan. 2017.
  31. X. Lu, B. Wang, Z.-H. Wen, X.-J. Zhao, Y. Cao, and A. Bermak, “A Low Power Relaxation Oscillator with Process Insensitive Auto-Calibration Scheme,” IEEE Asia Pacific Conf. Circuits Syst. (APCCAS), Jeju, Korea, pp. 694–697, Oct. 2016.
  32. B. Zhang, X.-P. Zhong, B. Wang, P. V. Sander, and A. Bermak, “Wide Dynamic Range PSD Algorithms and Their Implementation for Compressive Imaging,” IEEE Int. Symp. Circuits Syst. (ISCAS), Montreal, QC, Canada, pp. 2727–2730, May 2016.
  33. B. Wang, M.-K. Law, S. Mohamad, and A. Bermak, “A 2.2μW 15b Incremental Delta-Sigma ADC with Output-Driven Input Segmentation,” IEEE/ACM Asia South Pacific Design Autom. Conf. (ASP-DAC), University Design Contest, Macao, China, pp. 7–8, Jan. 2016. (Best Design Award)
  34. X.-P. Zhong, B. Wang, and A. Bermak, “A Reconfigurable Time-Domain Comparator for Multi-Sensing Applications,” IEEE Int. Symp. Circuits Syst. (ISCAS), Lisbon, Portugal, pp. 349–352, May 2015.
  35. B. Wang, M.-K. Law, and A. Bermak, “A Low-Cost Capacitive Relative Humidity Sensor for Food Moisture Monitoring Application,” Asia Symp. Quality Electron. Design (ASQED), Penang, Malaysia, pp. 95–99, Jul. 2012.
  36. F. Tang, B. Wang, and A. Bermak, “80 dB Dynamic Range 100 kHz Bandwidth Inverter-Based ΣΔ ADC for CMOS Image Sensor,” IEEE Int. Symp. Circuits Syst. (ISCAS), Seoul, Korea, pp. 3094–3097, May 2012.
  37. B. Wang, M.-K. Law, F. Tang, and A. Bermak, “A Sub-1V BJT-Based CMOS Temperature Sensor from −55°C to 125°C,” IEEE Int. Symp. Circuits Syst. (ISCAS), Seoul, Korea, pp. 3114–3117, May 2012.

Patents

  1. B. Wang, “High Performance CMOS Shooting Integrator,” U.S. Patent Appl. Pub. 2026/0155785 A1, Jun. 4, 2026.
  2. B. Wang, “Complementary Metal-Oxide-Semiconductor Temperature Sensor with Wide-Range Sensing Capability and High Energy-Efficiency,” U.S. Patent 12 613 142, Apr. 28, 2026.
  3. B. Wang and M. A. Awan, “Integrated Laser Doppler Blood Flow Measurement System and Methods of Use,” U.S. Patent 12 471 795, Nov. 18, 2025.
  4. B. Wang, “Passive RFID Tag with Embedded Sensor Interface,” U.S. Patent 12 412 060, Sep. 9, 2025.
  5. B. Wang and J. Schneider, “Linear Decimation Filters for Incremental Delta-Sigma Analog to Digital Converters,” U.S. Patent Appl. Pub. 2024/0178819 A1, May 30, 2024.
  6. B. Wang, H. F. Zhu, J. Liu, J. Yi, and Q. B. Zhu, “Chip Wiring Layer Temperature Sensing Circuit, Temperature Sensing Method and Chip Thereof,” U.S. Patent 11 686 624, Jun. 27, 2023.

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